Technical details
Sustainability certificatesRoHS
Features
Memory bandwidth (max)12.8 GB/s
Memory clock speed1600 MHz
Memory form factor240-pin DIMM
CAS latency11
Internal memory4 GB
Memory channelsDual-channel
ECCN
Memory layout (modules x size)1 x 4 GB
Internal memory typeDDR3
Component forPC/Server
Memory voltage1.35 V
Buffered memory typeUnregistered (unbuffered)
JEDEC standardY
Operational conditions
Storage temperature (T-T)-55 - 100 °C
Operating temperature (T-T)0 - 85 °C
Weight & dimensions
Width133 mm
Height30 mm
Weight19 g
Packaging data
Package weight37 g
Package width168 mm
Package height88 mm
Other features
Country of originChina
Chips organisationx8 FBGA DRAM